Abstract Description:

The non-destructive slicer is developed with the development of large-scale silicon chips. Because of the high mechanical load requirements for micro cracks and components of large-size batteries, the non-destructive cracking is conducted by tensile and compression stress, which abandons the traditional mechanical cracks and reduces the crack production, thus improving the bending strength of the battery and the mechanical load of the components.

Equipment summary:

The non-destructive slicing machine uses laser and cooling medium to heat and cool the battery instantly, so that tensile stress and pressure stress are generated in the inner of the cell to split;

Equipment performance:

The only single line high capacity equipment in the market;

It has the advantages of high light and high mechanical load with traditional infrared cutting;

It has the function of fast switching;

The battery type has high compatibility;